LrgpV1, Main, Exploration, bibRecord, 001625

Complexation chemistry in copper plating from citrate baths

Identifieur interne : 001625 ( Main/Exploration ); précédent : 001624; suivant : 001626

Complexation chemistry in copper plating from citrate baths

Auteurs : Sabine Rode [France] ; Christophe Henninot [France] ; Cécile Vallieres [France] ; Michael Matlosz [France]

Source :

Journal of the Electrochemical Society [ 0013-4651 ] ; 2004.

RBID : Pascal:04-0385880

Descripteurs français

Pascal (Inist)
- Etude théorique, Modèle mathématique, Etude expérimentale, Interface électrode électrolyte, Dépôt électrolytique, Cuivre sulfate, Electrode disque, Solution aqueuse, Citrique acide, Contrôle cinétique, Propriété chimique, Constante association, Voltammétrie cyclique.

English descriptors

KwdEn :
- Aqueous solution, Association constant, Chemical properties, Citric acid, Copper sulfate, Cyclic voltammetry, Disk electrode, Electrode electrolyte interface, Electrodeposition, Experimental study, Kinetic control, Mathematical model, Theoretical study.

Abstract

An experimental and theoretical study of the influence of solution chemistry on the electrodeposition of copper from complexing citrate baths is proposed and discussed. The behavior of the system is described in terms of the relative distribution of various copper-citrate complexes, combined with a model mechanism for electrodeposition kinetics involving an adsorbed blocking intermediate. Studies of partial-current polarization curves for copper deposition over a wide range of solution pH and free citrate concentration substantiate the mechanism and offer convincing evidence for the significant role of solution chemistry in the electroreduction process. In addition to the copper system, the mechanism proposed offers a framework that may be useful for the study of other metals and alloys electrodeposited from complexing baths containing citrate or citrate-like molecules.

Affiliations:

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Le document en format XML

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<front><div type="abstract" xml:lang="en">An experimental and theoretical study of the influence of solution chemistry on the electrodeposition of copper from complexing citrate baths is proposed and discussed. The behavior of the system is described in terms of the relative distribution of various copper-citrate complexes, combined with a model mechanism for electrodeposition kinetics involving an adsorbed blocking intermediate. Studies of partial-current polarization curves for copper deposition over a wide range of solution pH and free citrate concentration substantiate the mechanism and offer convincing evidence for the significant role of solution chemistry in the electroreduction process. In addition to the copper system, the mechanism proposed offers a framework that may be useful for the study of other metals and alloys electrodeposited from complexing baths containing citrate or citrate-like molecules.</div>
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Complexation chemistry in copper plating from citrate baths

Complexation chemistry in copper plating from citrate baths

Source :

Descripteurs français

English descriptors

Abstract

Links toward previous steps (curation, corpus...)

Le document en format XML

Pour manipuler ce document sous Unix (Dilib)

Pour mettre un lien sur cette page dans le réseau Wicri